There are four types of packaging methods for electronic components

The carrier tape for electronic component packaging carriers is mainly used in the electronic component mounting industry. It is used in combination with cover tape (upper sealing tape) to load and store electronic components in the pockets of precision hardware carrier tape.

Four ways of carrier tape packaging

一、The Embossed Carrier Tape Packaging (Tape and Reel) is the most widely used, the longest application time, adaptability, and high efficiency of the chip processing of a form of packaging, have been standardized. In addition to QFP, PLCC, BGA, and other large devices, the rest of the SMT chip components can be used in this form of packaging. The carrier tape used mainly has paper carrier tape, plastic carrier tape, and adhesive carrier tape 3 kinds.

1. Paper Carrier Tape by the bottom tape, carrier tape, cover tape, and paper winding disk.

The small round hole on the belt is the positioning hole, so that the feeder on the gear

drive; rectangular hole for the material cavity, components put on the winding on the

material tray.

2. Plastic Carrier Tape and paper carrier tape structure is roughly the same size, the

difference is that the material box is convex.

3. Adhesive carrier tape The bottom side of the tape, IC on the tape, and double-row hole

drive, SMT placement processing, the feeder on the lower peeling device.

二、Tube Packaging (Tube) is mainly used for packaging rectangular, chip components

and small SMD and certain shaped components, such as SOP, SOJ, PLCC and other

integrated circuits, suitable for a variety of small batch of products. Rod packaging shape

is a long tube with a rectangular inner cavity, packaging rectangular components; the inner cavity is shaped, used for packaging shaped components.

三、The Tray Packaging (Tray), also known as the waffle tray (Waffle), there is a single

layer, up to more than 100 layers. Tray packaging is mainly used for the packaging of

components with larger body shape or easier to damage pins, such as QFP, narrow pitch

SOP, PLCC, BGA and other integrated circuits and other devices.

四、Bulk (In bulk) Pinless, non-polarized surface assembly components can be bulked

(Bulk), such as general rectangular and cylindrical capacitors and resistors. Bulk

components are low cost, but are not conducive to pick and place on placement

processing equipment.