What does IC chip taping mean? Component packaging method selection

IC chip taping packaging technology is a process technology that wraps memory chips to avoid contact with the outside world and prevent damage to the chips from the outside world. Impurities and undesirable gases in the air, and even water vapor, can corrode the precision circuitry on the chip, which in turn can cause degradation of electrical performance. Different packaging technologies vary greatly in terms of manufacturing processes and techniques, and IC chip taping plays a vital role in the performance of the memory chip itself.

What is IC chip taping?

IC, or integrated circuit, is a semiconductor manufacturing process in which many transistors, resistors, capacitors and other components are made on a small single-crystal silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or attempted wiring. In the circuit, the letter “IC” (or “N”, etc.) is used. What is IC chip wiring? It is the process of putting electronic components together in a ribbon-like package. The tape is placed on a disk. This is IC tape braiding.

What is tape braiding?

Taping is a process in small capacitors. Before spraying gold, the core is made into a disk with tape paper and the side of the core is protected so that the spraying gold does not spray to the side of the core and does not cause a short circuit. Small plastic case capacitors and small plastic sealed capacitors also have a finished tape making process, which is to weave the capacitors one by one onto a paper tape and wind them up for packaging and storage. The use of equipment is the braiding machine, which is also known as braiding packaging machine, tape packaging machine, mainly for packaging SMD materials, LED, inductors, resistors and other reel packaging. Taping packaging is a new type of packaging. The machine is mainly divided into automatic, semi-automatic, electric type three categories. Taping machine using materials including: top cover tape, carrier tape, reel, adaptable components: resistors, diodes, color code inductors, transistors, fuses, aluminum electrolytic capacitors, transistors, LED / light-emitting such as resistors, resistors generally have two types of packaging, a braided tape, that is, the resistors in a row, with tape connected to a kind of bulk, that is, one by one resistors independent of each other. Packed in boxes or bags.

The role of component packaging

(1) play a protective role for the chip. After packaging so that the chip is not damaged by external factors, not due to changes in external conditions that affect the normal work of the chip.

(2) after packaging the chip through the external pinout line (or pin) with the external system has a convenient phase of reliable electrical connection.

(3) will chip in the work of the heat generated through the packaging shell to disperse, from the study to ensure that the chip temperature is maintained below the maximum amount.

(4) can make the chip and the external system to achieve reliable signal transmission and maintain the integrity of the signal.

For the component logistics of the packaging method in the end what is important? Let’s take a look!

1、Braided tape packaging

In the chip specification book is generally Reel said that the braided tape, commonly known as reel packaging, which is the most and most common packaging method in SMT, because SMT using automated equipment, to the machine shelf to achieve automatic placement purposes, roll tape is the most commonly used specifications. It can be said that in the patch materials, more than 90% of the materials are braided packaging, can achieve the best degree of automated production, of course, the actual many goods can only be made into braided tape way, braided tape way is generally our optimal choice.

2、Tray packaging

For some IC chips, especially QFP ＼ TQFP ＼ BGA (when the number of feet is greater than 48), because of the size of the larger, the general form of packaging for this type of chip is the tray method, and generally there is not much room for choice. In order to ensure that the IC pins are not deformed, tape packaging may not be suitable for QFPs and TQFPs, so making them in tray form may help to protect the pins.

For some small pin count and small size TQFP chips, both tape and pallet packaging exist, so we still prefer tape. Tray packaging in SMT because of the large size, a relatively small number of packages, after the unpacking must be each tray to check to confirm the pin deformation, and then the entire unpacking, inspection, into the operation is all manual operation, there will be hands touched, there is a high probability of chip pins, will fall and other adverse effects.

3、Tube mounted

This is not very recommended, tube mounted is an amazing existence, SMT, chip development for so many years, as if there are still a large number of tube mounted, or even only tube mounted options. Like this 8-foot, 16-foot, 20-foot SOP chip, tube mounted and braided tape packaging is almost coexisting, considering that the manufacturer’s packaging method is distinguished by material number, both have a choice, according to the actual situation to use.

The biggest problem with the current tube packaging method in our This is the factory can not go directly to the patch, the effect is not good and the process and instability, will also affect the efficiency, so there is no cost industry mainstream. So the current practice is to pour out the chip in the tube, re-installed on the drag tray, simulating the second way of operation mentioned above. Imagine thousands of chips poured out of the tube, but also placed in the tray, first of all, the cost of the tray to order, not to mention the workload on the inverted chip placement is very large, and there is a quality risk, the risk of deformation of the chip pins in the process, there is the risk of placing the reverse, and a series of problems. Here you may understand, this type of IC if the tube will produce how much impact. So we are under the material number, to check the specifications, there is no braided material number, as far as possible to choose braided packaging.

4、Loose material

This is really a choice of last resort. Bulk material needless to say, only manual hands on the PCB board operation, as you can imagine, can not operate in bulk, affecting the quality and efficiency. The general chip will not have loose material, more likely to be other components, such as power LED lights / FPC seat and other such components, the supplier shipping is a bag wrapped in a clump inside. This is only suitable for small workshop work small batch production, or R & D testing use, rather than for normal mass production of products.