A method of making a heat sealing cover tape structure

Cover tape is a tape product used in the field of electronic packaging. It cooperates with the carrier tape (carrier tape) to use, the electronic components such as resistors, capacitors, transistors, diodes, etc. are stored in the pockets of the carrier tape, and the cover tape is sealed above the pockets formed by the carrier tape to form a closed packaging, which is used to protect the electronic components from contamination and damage in transit. When electronic components are installed, the cover tape is stripped, and the automatic installation equipment, through the precise positioning of the index hole of the carrier tape, takes out the components held in the pocket in turn and installs them on the integrated circuit board.

Background technology of heat sealing cover tape

In the existing technology, the heat seal type cover tape product generally requires the light transmission rate is not high, but for the need to observe through the cover tape in the carrier tape pocket electronic components chip marking process, it may not be able to meet the production requirements, and the production process procedure is more.

Heat sealing cover tape technical features

1. a heat sealing cover tape structure, characterized in that it includes a substrate layer, an adhesive layer and a heat sealing layer laminated in sequence from top to bottom; the substrate layer is a biaxially oriented polyester film, and the heat sealing layer is a thermoplastic elastomer layer; a number of antistatic particles are also provided between the adhesive layer and said heat sealing layer; a number of silica particles are also provided on the outer surface of the heat sealing layer, and the local part of the silica particles protrudes outwardly from the outer surface of the heat sealing layer.

2. heat sealing cover tape structure, characterized in that the outer surface of the substrate layer is also provided with a number of silica particles, silica particles from the outer surface of the substrate layer outwardly protruding.

3. heat sealing cover tape structure, characterized in that the antistatic particles are copper powder particles, nickel powder particles or silver powder particles, the antistatic particles have a particle size of 5-10 microns.

4. heat sealing cover tape structure, characterized in that the said adhesive layer is acrylic adhesive layer or acrylic-polyester adhesive layer.

5. Heat sealing cover tape structure, characterized in that the particle size of said silica particles is 5-10 microns.

6. Heat sealing cover tape structure, characterized in that the heat-sealed layer is a SBS material layer, a SEBS material layer, a SIS material layer or a SEPS material layer.

7. Heat sealing cover tape structure, characterized in that the thickness of said base material layer is 19-25 μm, the thickness of said adhesive layer is 2-5 μm, and the thickness of the heat-sealed layer is 10-25 μm.

Heat sealing cover tape technical summary

A new heat sealing cover tape structure is disclosed, including the base material layer, adhesive layer and heat sealing layer, which are laminated in order from top to bottom; the base material layer is a biaxially oriented polyester film, and the heat sealing layer is a thermoplastic elastomer layer; there are also a number of antistatic particles between the adhesive layer and the heat sealing layer; the outer surface of the heat sealing layer is also provided with a number of silica particles, and the local part of the silica particles protrudes outward from the outer surface of the heat sealing layer. The new type has the characteristics of high light transmission, high temperature resistance, anti-static and good anti-adhesive effect.